Please use this identifier to cite or link to this item: http://elar.uspu.ru/handle/uspu/5338
Title: Physical properties of some Sn-based melts
Authors: Sidorov, V.
Uporov, S.
Rozitsina, E.
Yagodin, D.
Grushevskij, K.
Ilinykh, N.
Issue Date: 2011
Publisher: E D P SCIENCES
Citation: Physical properties of some Sn-based melts / V. Sidorov, S. Uporov, E. Rozitsina [и др.] // LAM14 - XIV liquid and amorphous metals conference. — 2011. — Vol. 15.
Abstract: The physical properties (viscosity, density, electroresistivity and magnetic susceptibility) of pure tin, copper, silver, some binary (Sn - Ag, Sn - Cu, Sn - Bi, Sn - Zn) and ternary (Sn-Ag-Cu, Sn-Bi-Ag, Sn-Bi-Zn) alloys with near eutectic compositions are investigated in wide temperature ranges. The irreversible decrease of viscosity in pure tin melt is discovered at 820 degrees C during heating. The similar anomaly with the following hysteresis of dynamic viscosity was fixed for binary and ternary alloys but at higher temperatures - 900 degrees C and 950 degrees C respectively. For all the systems it was shown that the alloys with eutectic compositions differ significantly in their electric and magnetic properties from hypo- and hypereutectic ones. Qualitative and quantitative metallographic analysis for Sn-3.8wt.%Ag-0.7wt.%Cu samples, heated low and above characteristic temperatures, showed the influence of melt overheating on crystallization kinetics.
Keywords: SOLDER
RELIABILITY
URI: http://elar.uspu.ru/handle/uspu/5338
Conference name: 14th International Conference on Liquid and Amorphous Metals (LAM)
Conference date: JUL 11-16, 2010
DOI: 10.1051/epjconf/20111501015
Appears in Collections:Научные публикации, проиндексированные в Scopus и Web of Science

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