Structure and electric resistance of Sn-Cu(Ag) solders in the precrystallization temperature range

Mudryi, S. I.; Shtablavyi, I. I.; Sklyarchuk, V. M.; Plevachuk, Yu. O.; Korolyshyn, A. V.; Yakymovych, A. S.; Shevernoha, I. M.; Sidorov, B. E.

Please use this identifier to cite or link to this item: http://elar.uspu.ru/handle/uspu/5340

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DC Field	Value	Language
dc.contributor.author	Mudryi, S. I.	en
dc.contributor.author	Shtablavyi, I. I.	en
dc.contributor.author	Sklyarchuk, V. M.	en
dc.contributor.author	Plevachuk, Yu. O.	en
dc.contributor.author	Korolyshyn, A. V.	en
dc.contributor.author	Yakymovych, A. S.	en
dc.contributor.author	Shevernoha, I. M.	en
dc.contributor.author	Sidorov, B. E.	en
dc.date.accessioned	2017-06-08T12:09:58Z	-
dc.date.available	2017-06-08T12:09:58Z	-
dc.date.issued	2011	-
dc.identifier.citation	Structure and electric resistance of Sn-Cu(Ag) solders in the precrystallization temperature range / S. I. Mudryi, I. I. Shtablavyi, V. M. Sklyarchuk [и др.] // Materials science. — 2011. — Vol. 46, iss. 4. — P. 464-472.	en
dc.identifier.issn	1068-820X	-
dc.identifier.other	sihor@ukr.net	-
dc.identifier.other	Yakymovych, Andriy/0000-0002-2884-9984	-
dc.identifier.other	State Foundation for Fundamental Research [F-28.3/024]	-
dc.identifier.other	WOS:000288667500005	-
dc.identifier.uri	http://elar.uspu.ru/handle/uspu/5340	-
dc.description	This work was partially supported by the State Foundation for Fundamental Research (Project No. F-28.3/024).	en
dc.description.abstract	We investigate the atomic structure of tin-based solders by X-ray diffraction methods and the reverse Monte Carlo method. Total and partial structural factors and pair correlation functions are calculated. It is shown that Sn0.987Cu0.013, Sn0.962Ag0.038, and Sn0.949Ag0.038Cu0.013 liquid alloys are characterized by a microinhomogeneous structure with Cu(Ag)-Sn clusters distributed in the tin-based matrix.	en
dc.language.iso	en	en
dc.publisher	CONSULTANTS BUREAU/SPRINGER	en
dc.source	Materials science	en
dc.subject	SOLDER	en
dc.subject	ATOMIC STRUCTURE	en
dc.subject	CLUSTERS	en
dc.subject	MICROINHOMOGENEOUS STRUCTURE	en
dc.subject	LIQUID-METALS	en
dc.subject	TRANSPORT PROPERTIES	en
dc.subject	SN ALLOYS	en
dc.subject	ORDER	en
dc.title	Structure and electric resistance of Sn-Cu(Ag) solders in the precrystallization temperature range	en
dc.type	Article	en
dc.type	info:eu-repo/semantics/article	en
dc.type	info:eu-repo/semantics/publishedVersion	en
Appears in Collections:	Научные публикации, проиндексированные в Scopus и Web of Science

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