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Title: | Structure and electric resistance of Sn-Cu(Ag) solders in the precrystallization temperature range |
Authors: | Mudryi, S. I. Shtablavyi, I. I. Sklyarchuk, V. M. Plevachuk, Yu. O. Korolyshyn, A. V. Yakymovych, A. S. Shevernoha, I. M. Sidorov, B. E. |
Issue Date: | 2011 |
Publisher: | CONSULTANTS BUREAU/SPRINGER |
Citation: | Structure and electric resistance of Sn-Cu(Ag) solders in the precrystallization temperature range / S. I. Mudryi, I. I. Shtablavyi, V. M. Sklyarchuk [и др.] // Materials science. — 2011. — Vol. 46, iss. 4. — P. 464-472. |
Abstract: | We investigate the atomic structure of tin-based solders by X-ray diffraction methods and the reverse Monte Carlo method. Total and partial structural factors and pair correlation functions are calculated. It is shown that Sn0.987Cu0.013, Sn0.962Ag0.038, and Sn0.949Ag0.038Cu0.013 liquid alloys are characterized by a microinhomogeneous structure with Cu(Ag)-Sn clusters distributed in the tin-based matrix. |
Keywords: | SOLDER ATOMIC STRUCTURE CLUSTERS MICROINHOMOGENEOUS STRUCTURE LIQUID-METALS TRANSPORT PROPERTIES SN ALLOYS ORDER |
URI: | http://elar.uspu.ru/handle/uspu/5340 |
Appears in Collections: | Научные публикации, проиндексированные в Scopus и Web of Science |
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