Structure and electric resistance of Sn-Cu(Ag) solders in the precrystallization temperature range

Please use this identifier to cite or link to this item: http://elar.uspu.ru/handle/uspu/5340

Title:	Structure and electric resistance of Sn-Cu(Ag) solders in the precrystallization temperature range
Authors:	Mudryi, S. I. Shtablavyi, I. I. Sklyarchuk, V. M. Plevachuk, Yu. O. Korolyshyn, A. V. Yakymovych, A. S. Shevernoha, I. M. Sidorov, B. E.
Issue Date:	2011
Publisher:	CONSULTANTS BUREAU/SPRINGER
Citation:	Structure and electric resistance of Sn-Cu(Ag) solders in the precrystallization temperature range / S. I. Mudryi, I. I. Shtablavyi, V. M. Sklyarchuk [и др.] // Materials science. — 2011. — Vol. 46, iss. 4. — P. 464-472.
Abstract:	We investigate the atomic structure of tin-based solders by X-ray diffraction methods and the reverse Monte Carlo method. Total and partial structural factors and pair correlation functions are calculated. It is shown that Sn0.987Cu0.013, Sn0.962Ag0.038, and Sn0.949Ag0.038Cu0.013 liquid alloys are characterized by a microinhomogeneous structure with Cu(Ag)-Sn clusters distributed in the tin-based matrix.
Keywords:	SOLDER ATOMIC STRUCTURE CLUSTERS MICROINHOMOGENEOUS STRUCTURE LIQUID-METALS TRANSPORT PROPERTIES SN ALLOYS ORDER
URI:	http://elar.uspu.ru/handle/uspu/5340
Appears in Collections:	Научные публикации, проиндексированные в Scopus и Web of Science

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